Failure Analysis Technology and Equipment

Electrical parameter test analysis

electric signal

Determining Failure Modes and Failing Pin Locations

Scanning Acoustic Microscopy (SAM)

Ultrasound

Ultrasound

Measurement of ultrasonic propagation, analysis of elastic properties of materials, analysis of crystal defects and multilayer structures, non-destructive analysis of structural sections

X-ray Fluoroscopy

X-ray

X-ray intensity

Inspect the internal structure of electronic components and multilayer PCB boards

X-ray Photoelectron Spectroscopy (XPS)

characteristic X-ray

optoelectronics

Determine shell energy levels by measuring photoelectron energy, use chemical shifts to measure chemical bonds and compounds, element determination, chemical shifts

Microscopic Infrared Absorption Spectroscopy (FTIR)

Infrared

Infrared absorption spectrum

Identify molecular functional groups, organic structure analysis

Secondary ion mass spectrometry (SIMS)

ion

secondary ions

Element determination, surface element distribution

optical microscope

visible light

reflected light

Surface topography, dimension measurement, defect observation

Scanning Electron Microscopy (SEM)

electronic

Secondary electrons, backscattered electrons

Surface topography, crystal defects, potential distribution,

Voltage Contrast Image, Voltage Strobe

X-ray energy dispersive analysis (EDS)

electronic

characteristic X-ray

Elemental Analysis and Elemental Distribution

Auger Electron Spectroscopy (AES)

electronic

Auger Electronics

Surface element determination and element depth distribution

Focused Ion Beam (FIB)

ion

secondary ions

Section Machining and Observation

Transmission Electron Microscopy (TEM)

electronic

electronic

Cross-sectional morphology observation, lattice structure analysis